Section 523-02: Science and engineering | ![](/icons/ecblank.gif) |
| 523-02-03 | | electro-wetting on dielectric | ![](/icons/ecblank.gif) |
Section 523-03: Material science | ![](/icons/ecblank.gif) |
| 523-03-01 | | maximum force, <in a cycle> | ![](/icons/ecblank.gif) |
| 523-03-02 | | minimum force, <in a cycle> | ![](/icons/ecblank.gif) |
| 523-03-09 | | deflection, <of a test piece> | ![](/icons/ecblank.gif) |
| 523-03-14 | | instantaneous failure strength | ![](/icons/ecblank.gif) |
| 523-03-20 | | elongation at electrical failure | ![](/icons/ecblank.gif) |
Section 523-04: Functional elements | ![](/icons/ecblank.gif) |
| 523-04-11 | | shape-memory alloy actuator | ![](/icons/ecblank.gif) |
Section 523-05: Machining technology | ![](/icons/ecblank.gif) |
| 523-05-13 | | deep reactive ion etching | ![](/icons/ecblank.gif) |
| 523-05-14 | | inductively coupled plasma | ![](/icons/ecblank.gif) |
Section 523-06: Bonding and assembling technology | ![](/icons/ecblank.gif) |
| 523-06-04 | | surface-activated bonding | ![](/icons/ecblank.gif) |
| 523-06-06 | | packaging, <of components> | ![](/icons/ecblank.gif) |
Section 523-07: Measurement technology | ![](/icons/ecblank.gif) |
| 523-07-01 | | scanning probe microscope | ![](/icons/ecblank.gif) |
| 523-07-03 | | spectroscopic ellipsometry | ![](/icons/ecblank.gif) |
Section 523-08: Application technologies | ![](/icons/ecblank.gif) |
| 523-08-12 | | polymerase chain reaction | ![](/icons/ecblank.gif) |