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IEVref:523-05-07ID:
Language:enStatus: Standard
Term: laser dicing
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Definition: wafer-cutting technology using a laser light that is radiated and scanned along dicing lines on a substrate

Note 1 to entry: In a cutting process where blade dicing is difficult to use, the laser dicing method is widely used where a laser light is focused inside the substrate and modified layers are formed beneath the scribe lines, and finally the wafer is diced by a mechanical expansion.


Publication date:2018-12
Source:IEC 62047-1:2016, 2.5.19
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