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IEVref:523-06-04ID:
Language:enStatus: Standard
Term: surface-activated bonding
Synonym1: SAB
[Preferred]
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Definition: process for bonding two substrates directly by increasing the surface energy of each substrate using ion beam or plasma irradiation

Note 1 to entry: Surface-activated bonding is effective in reducing thermal stress because the temperature in the bonding process is comparably low. In MEMS devices, surface-activated bonding is expected to be applied to the substrate bonding such as hermetic sealing.

Note 2 to entry: This note applies to the French language only.


Publication date:2018-12
Source:IEC 62047-1:2016, 2.6.5, modified – "Surface activated bonding" has been replaced with "surface-activated bonding".
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