(Untitled) (Untitled)(Untitled) (Untitled)(Untitled) (Untitled)(Untitled) (Untitled)(Untitled)Examples




IEVref:523-06-08ID:
Language:enStatus: Standard
Term: through-silicon-via
Synonym1: TSV
[Preferred]
Synonym2:
Synonym3:
Symbol:
Definition: perpendicularly penetrating electro interconnection between both surfaces of a silicon substrate

Note 1 to entry: Through-silicon-vias are mainly applied to three-dimensionally stacked packaging of semiconductor devices. In the MEMS fields, the through-silicon-vias are applied to wafer level packaging technology. Some through-silicon-vias consist of through-via, insulator and electrode material. Solder, copper, doped-poly-silicon and so on are used as electrode materials.

Note 2 to entry: This note applies to the French language only.


Publication date:2018-12
Source:IEC 62047-1:2016, 2.6.11
Replaces:
Internal notes:
CO remarks:
TC/SC remarks:
VT remarks:
Domain1:
Domain2:
Domain3:
Domain4:
Domain5: