|Definition:|| process for protecting components by mounting them in a container having external terminals
Note 1 to entry: The purpose of packaging is to minimize external chemical and physical damage to the components. As the device is miniaturized, strain due to the packaging stress is possibly troublesome. To prevent this, amongst other things, the bonding technology that joins microcomponents and so on to a silicon chip is important. In the field of sensor systems, a hybrid integration technology is necessary, which has resulted in special packaging techniques being studied.