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IEVref:523-05-11ID:
Language:enStatus: Standard
Term: sacrificial etching
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Definition: micromachining in which an intermediate layer sandwiched between two layers of a different material is preferentially (sacrificially) etched and selectively removed

Note 1 to entry: Usually, the etch selectivity is high between the intermediate layer and the two sandwich layers. The purpose of the sacrificial layer is to mechanically release one or both of the sandwich layers. Silicon oxide is a commonly used sacrificial layer.


Publication date:2018-12
Source:IEC 62047-1:2016, 2.5.26
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