International Electrotechnical Commission
Glossary

Terms defined by SC 47A


Hide details for absolute maximum continuous ratingsabsolute maximum continuous ratings
IEC 60748-2-20, ed. 2.0 (2008)
Hide details for active circuit areaactive circuit area
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for active hybrid film integrated circuitactive hybrid film integrated circuit
IEC 60748-1, ed. 2.0 (2002)
Hide details for active IC function moduleactive IC function module
IEC 61967-4-1, ed. 1.0 (2005)
Hide details for active portactive port
IEC 61967-4-1, ed. 1.0 (2005)
Hide details for add-on substrateadd-on substrate
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for added componentadded component
IEC 60748-23-1, ed. 1.0 (2002)
Hide details for altitudealtitude
IEC 61967-3, ed. 1.0 (2014)
IEC 62132-9, ed. 1.0 (2014)
Hide details for amplitude modulation; AMamplitude modulation; AM
IEC 62132-1, ed. 2.0 (2015)
Hide details for analoganalog
IEC 61967-4-1, ed. 1.0 (2005)
Hide details for anechoic materialanechoic material
IEC 62132-2, ed. 1.0 (2010)
Hide details for artificial network, ANartificial network, AN
IEC 61967-1, ed. 1.0 (2002)
IEC 62132-1, ed. 2.0 (2015)
Hide details for associated equipmentassociated equipment
IEC 61967-1, ed. 1.0 (2002)
IEC 62132-1, ed. 2.0 (2015)
Hide details for attachment mediumattachment medium
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for auto sweepauto sweep
IEC 61967-1, ed. 1.0 (2002)
Hide details for [<span>auxiliary equipment</span>]auxiliary equipment
IEC 62215-3, ed. 1.0 (2013)
Hide details for auxiliary equipment, AEauxiliary equipment, AE
IEC 62132-1, ed. 2.0 (2015)
Hide details for bias teebias tee
IEC 62132-1, ed. 2.0 (2015)
Hide details for blank terminalblank terminal
IEC 60748-1, ed. 2.0 (2002)
Hide details for blister, metallizationblister, metallization
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for block resistorblock resistor
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for bonding padbonding pad
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for bonding sitebonding site
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for bridgingbridging
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for broadband emissionbroadband emission
IEC 61967-1, ed. 1.0 (2002)
Hide details for broadband line terminationbroadband line termination
IEC 62132-2, ed. 1.0 (2010)
Hide details for burn-inburn-in
IEC 60748-23-1, ed. 1.0 (2002)
Hide details for [<span>burst</span>]burst
IEC 62215-3, ed. 1.0 (2013)
Hide details for capability qualifying component (CQC)capability qualifying component (CQC)
IEC 60748-23-1, ed. 1.0 (2002)
Hide details for category dissipationcategory dissipation
IEC 60748-23-1, ed. 1.0 (2002)
Hide details for certified manufacturing linecertified manufacturing line
IEC 60748-23-1, ed. 1.0 (2002)
Hide details for characteristic impedancecharacteristic impedance
IEC 61967-8, ed. 1.0 (2011)
IEC 62132-2, ed. 1.0 (2010)
IEC 62132-8, ed. 1.0 (2012)
Hide details for childchild
IEC 61967-1-1, ed. 2.0 (2015)
Hide details for (code) transition value(code) transition value
IEC 60748-4-3, ed. 1.0 (2006)
Hide details for coherent samplingcoherent sampling
IEC 60748-4-3, ed. 1.0 (2006)
Hide details for cold solder jointcold solder joint
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for common-mode pointcommon-mode point
IEC 62132-5, ed. 1.0 (2005)
Hide details for common-mode portcommon-mode port
IEC 62132-5, ed. 1.0 (2005)
Hide details for common mode (CM) currentcommon mode (CM) current
IEC 61967-4-1, ed. 1.0 (2005)
Hide details for common mode currentcommon mode current
IEC 61967-1, ed. 1.0 (2002)
IEC 62132-1, ed. 2.0 (2015)
Hide details for common mode voltagecommon mode voltage
IEC 62132-1, ed. 2.0 (2015)
Hide details for common mode voltage; asymmetrical voltagecommon mode voltage; asymmetrical voltage
IEC 61967-1, ed. 1.0 (2002)
Hide details for compound bondcompound bond
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for conducted emissionsconducted emissions
IEC 61967-1, ed. 1.0 (2002)
Hide details for conductive attachconductive attach
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for conductive substrateconductive substrate
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for contact windowcontact window
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for continuous disturbancecontinuous disturbance
IEC 61967-1, ed. 1.0 (2002)
Hide details for continuous wave, CWcontinuous wave, CW
IEC 62132-1, ed. 2.0 (2015)
Hide details for controlled environmentcontrolled environment
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for corecore
IEC 61967-4-1, ed. 1.0 (2005)
Hide details for corrosioncorrosion
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for coupling (air) bridgecoupling (air) bridge
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for coupling networkcoupling network
IEC 62132-1, ed. 2.0 (2015)
Hide details for [<span>coupling network</span>]coupling network
IEC 62215-3, ed. 1.0 (2013)
Hide details for crazingcrazing
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for crossovercrossover
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for custom designedcustom designed
IEC 60748-23-1, ed. 1.0 (2002)
Hide details for decoupling networkdecoupling network
IEC 62132-1, ed. 2.0 (2015)
Hide details for detritusdetritus
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for device under test, DUTdevice under test, DUT
IEC 61967-1, ed. 1.0 (2002)
IEC 62132-1, ed. 2.0 (2015)
Hide details for die shrinkdie shrink
IEC 61967-1, ed. 1.0 (2002)
IEC 62132-1, ed. 2.0 (2015)
Hide details for dielectricdielectric
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for dielectric attachdielectric attach
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for differential mode currentdifferential mode current
IEC 61967-1, ed. 1.0 (2002)
IEC 62132-1, ed. 2.0 (2015)
Hide details for differential mode (DM) currentdifferential mode (DM) current
IEC 61967-4-1, ed. 1.0 (2005)
Hide details for differential mode voltagedifferential mode voltage
IEC 61967-1, ed. 1.0 (2002)
IEC 62132-1, ed. 2.0 (2015)
Hide details for digitaldigital
IEC 61967-4-1, ed. 1.0 (2005)
Hide details for directional couplerdirectional coupler
IEC 62132-1, ed. 2.0 (2015)
Hide details for discontinuous disturbancediscontinuous disturbance
IEC 61967-1, ed. 1.0 (2002)
Hide details for [<span>DUT</span>]DUT
IEC 62215-3, ed. 1.0 (2013)
Hide details for edge metallizationedge metallization
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for effective number of bits, [<i>N</i><sub>ef</sub>]effective number of bits, Nef
IEC 60748-4-3, ed. 1.0 (2006)
Hide details for electrical enduranceelectrical endurance
IEC 60748-23-1, ed. 1.0 (2002)
Hide details for electrically commonelectrically common
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for electrically small PCBelectrically small PCB
IEC 61967-1, ed. 1.0 (2002)
Hide details for [<span>electrically small PCB</span>]electrically small PCB
IEC 62132-1, ed. 2.0 (2015)
Hide details for electrode (of a semiconductor device)electrode (of a semiconductor device)
IEC 60748-1, ed. 2.0 (2002)
Hide details for [<span>electromagnetic ambient</span>]electromagnetic ambient
IEC 62215-3, ed. 1.0 (2013)
Hide details for electromagnetic compatibility, EMCelectromagnetic compatibility, EMC
IEC 61967-1, ed. 1.0 (2002)
IEC 62132-1, ed. 2.0 (2015)
Hide details for electromagnetic emissionelectromagnetic emission
IEC 61967-1, ed. 1.0 (2002)
Hide details for electromagnetic environment (RF ambient)electromagnetic environment (RF ambient)
IEC 61967-1, ed. 1.0 (2002)
Hide details for electromagnetic radiation; radiated emissionselectromagnetic radiation; radiated emissions
IEC 61967-1, ed. 1.0 (2002)
Hide details for elementelement
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for embeddingembedding
IEC 60748-1, ed. 2.0 (2002)
Hide details for [<span>EMC</span>]EMC
IEC 62215-3, ed. 1.0 (2013)
Hide details for emission limit (from a disturbing source)emission limit (from a disturbing source)
IEC 61967-1, ed. 1.0 (2002)
Hide details for end terminated or wrap-around elementsend terminated or wrap-around elements
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for equivalent-time samplingequivalent-time sampling
IEC 60748-4-3, ed. 1.0 (2006)
Hide details for [<span>external terminal</span>]external terminal
IEC 62433-2, ed. 1.0 (2008)
Hide details for film circuit elementfilm circuit element
IEC 60748-23-1, ed. 1.0 (2002)
Hide details for film integrated circuitfilm integrated circuit
IEC 60748-1, ed. 2.0 (2002)
Hide details for film (of a film integrated circuit)film (of a film integrated circuit)
IEC 60748-1, ed. 2.0 (2002)
Hide details for fixed function unit, FFUfixed function unit, FFU
IEC 61967-4-1, ed. 1.0 (2005)
Hide details for foilfoil
IEC 60748-1, ed. 2.0 (2002)
Hide details for foreign materialforeign material
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for forward powerforward power
IEC 62132-1, ed. 2.0 (2015)
Hide details for garbage collectiongarbage collection
IEC 60748-1, ed. 2.0 (2002)
Hide details for garbage datagarbage data
IEC 60748-1, ed. 2.0 (2002)
Hide details for glassivationglassivation
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for global pinglobal pin
IEC 61967-4-1, ed. 1.0 (2005)
Hide details for [<span>global pin</span>]global pin
IEC 62215-3, ed. 1.0 (2013)
Hide details for ground plane, reference ground planeground plane, reference ground plane
IEC 62132-1, ed. 2.0 (2015)
Hide details for ground (reference) planeground (reference) plane
IEC 61967-1, ed. 1.0 (2002)
Hide details for hybrid film integrated circuithybrid film integrated circuit
IEC 60748-1, ed. 2.0 (2002)
Hide details for hybrid integrated circuithybrid integrated circuit
IEC 60748-1, ed. 2.0 (2002)
Hide details for hybrid semiconductor integrated circuithybrid semiconductor integrated circuit
IEC 60748-1, ed. 2.0 (2002)
Hide details for IC function moduleIC function module
IEC 61967-4-1, ed. 1.0 (2005)
Hide details for IC striplineIC stripline
IEC 61967-8, ed. 1.0 (2011)
IEC 62132-8, ed. 1.0 (2012)
Hide details for IC typeIC type
IEC 61967-4-1, ed. 1.0 (2005)
Hide details for immunityimmunity
IEC 62132-1, ed. 2.0 (2015)
Hide details for [<span>immunity</span>]immunity
IEC 62215-3, ed. 1.0 (2013)
Hide details for inactive portinactive port
IEC 61967-4-1, ed. 1.0 (2005)
Hide details for injection networkinjection network
IEC 62132-1, ed. 2.0 (2015)
Hide details for input clamping current [<i>I</i><sub>IK</sub>]input clamping current IIK
IEC 60748-1, ed. 2.0 (2002)
Hide details for input clamping voltage [<i>V</i><sub>IK</sub>]input clamping voltage VIK
IEC 60748-1, ed. 2.0 (2002)
Hide details for insulating layerinsulating layer
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for integrated circuitintegrated circuit
IEC 60748-1, ed. 2.0 (2002)
Hide details for integrated circuit, ICintegrated circuit, IC
IEC 61967-4-1, ed. 1.0 (2005)
Hide details for integrated electronicsintegrated electronics
IEC 60748-1, ed. 2.0 (2002)
Hide details for inter-block coupling, IBCinter-block coupling, IBC
IEC 62433-1, ed. 1.0 (2011)
Hide details for intermetallics (purple plague)intermetallics (purple plague)
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for internal activity, IAinternal activity, IA
IEC 62433-1, ed. 1.0 (2011)
Hide details for [<span>internal terminal</span>]internal terminal
IEC 62433-2, ed. 1.0 (2008)
Hide details for [<span>jitter</span>]jitter
IEC 62215-3, ed. 1.0 (2013)
Hide details for kerfkerf
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for latch-uplatch-up
IEC 60748-1, ed. 2.0 (2002)
Hide details for latch-up characteristics of integrated circuitslatch-up characteristics of integrated circuits
IEC 60748-1, ed. 2.0 (2002)
Hide details for latch-up current ([<i>I</i><sub>Xlatch</sub>], [<i>I</i><sub>latch</sub>])latch-up current (IXlatch, Ilatch)
IEC 60748-1, ed. 2.0 (2002)
Hide details for latch-up statelatch-up state
IEC 60748-1, ed. 2.0 (2002)
Hide details for latch-up state holding current ([<i>I</i><sub>CC(L)min</sub>], [<i>I</i><sub>DD(L)min</sub>])latch-up state holding current (ICC(L)min, IDD(L)min)
IEC 60748-1, ed. 2.0 (2002)
Hide details for latch-up state (supply) current ([<i>I</i><sub>CC(L)</sub>], [<i>I</i><sub>DD(L)</sub>])latch-up state (supply) current (ICC(L), IDD(L))
IEC 60748-1, ed. 2.0 (2002)
Hide details for latch-up state (supply) voltage ([<i>V</i><sub>CC(L)</sub>], [<i>V</i><sub>DD(L)</sub>])latch-up state (supply) voltage (VCC(L), VDD(L))
IEC 60748-1, ed. 2.0 (2002)
Hide details for latch-up supply current ([<i>I</i><sub>CClatch</sub>], [<i>I</i><sub>DDlatch</sub>])latch-up supply current (ICClatch, IDDlatch)
IEC 60748-1, ed. 2.0 (2002)
Hide details for latch-up supply voltage ([<i>V</i><sub>CClatch</sub>], [<i>V</i><sub>DDlatch</sub>])latch-up supply voltage (VCClatch, VDDlatch)
IEC 60748-1, ed. 2.0 (2002)
Hide details for latch-up voltage ([<i>V</i><sub>Xlatch</sub>], [<i>V</i><sub>latch</sub>])latch-up voltage (VXlatch, Vlatch)
IEC 60748-1, ed. 2.0 (2002)
Hide details for lead framelead frame
IEC 61967-1, ed. 1.0 (2002)
Hide details for local pinlocal pin
IEC 61967-4-1, ed. 1.0 (2005)
Hide details for [<span>local pin</span>]local pin
IEC 62215-3, ed. 1.0 (2013)
Hide details for lower category temperature (LCT)lower category temperature (LCT)
IEC 60748-23-1, ed. 1.0 (2002)
Hide details for marmar
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for measurement uncertaintymeasurement uncertainty
IEC 60748-23-1, ed. 1.0 (2002)
Hide details for measuring receivermeasuring receiver
IEC 61967-1, ed. 1.0 (2002)
Hide details for mechanical strength testsmechanical strength tests
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for metallization, multilayered (conductors)metallization, multilayered (conductors)
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for metallization, multilevel (conductors)metallization, multilevel (conductors)
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for metallization, operating (conductors)metallization, operating (conductors)
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for microcircuitmicrocircuit
IEC 60748-1, ed. 2.0 (2002)
Hide details for microelectronicsmicroelectronics
IEC 60748-1, ed. 2.0 (2002)
Hide details for multi-chip integrated circuitmulti-chip integrated circuit
IEC 60748-1, ed. 2.0 (2002)
Hide details for multi-chip module, MCMmulti-chip module, MCM
IEC 61967-1, ed. 1.0 (2002)
Hide details for multi IC setsmulti IC sets
IEC 61967-1, ed. 1.0 (2002)
Hide details for multilayer (connection) film circuitmultilayer (connection) film circuit
IEC 60748-1, ed. 2.0 (2002)
Hide details for narrowband emissionnarrowband emission
IEC 61967-1, ed. 1.0 (2002)
Hide details for narrowest resistor widthnarrowest resistor width
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for neck-downneck-down
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for nicking (partial cut)nicking (partial cut)
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for nodule, metallizationnodule, metallization
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for non-monometallic compound bondnon-monometallic compound bond
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for non-planar elementnon-planar element
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for non-usable terminalnon-usable terminal
IEC 60748-1, ed. 2.0 (2002)
Hide details for one-port TEM waveguideone-port TEM waveguide
IEC 62132-2, ed. 1.0 (2010)
Hide details for operating conditionsoperating conditions
IEC 60748-2-20, ed. 2.0 (2008)
Hide details for operating metallization (conductors)operating metallization (conductors)
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for original design separationoriginal design separation
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for original widthoriginal width
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for output characteristicsoutput characteristics
IEC 60748-2-20, ed. 2.0 (2008)
Hide details for output clamping current [<i>I</i><sub>OK</sub>]output clamping current IOK
IEC 60748-1, ed. 2.0 (2002)
Hide details for output clamping voltage [<i>V</i><sub>OK</sub>]output clamping voltage VOK
IEC 60748-1, ed. 2.0 (2002)
Hide details for oxide non-conformanceoxide non-conformance
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for packagepackage
IEC 60748-23-1, ed. 1.0 (2002)
Hide details for parentparent
IEC 61967-1-1, ed. 2.0 (2015)
Hide details for part-finishedpart-finished
IEC 60748-23-1, ed. 1.0 (2002)
Hide details for passivationpassivation
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for passivation steppassivation step
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for passive distribution network, PDNpassive distribution network, PDN
IEC 62433-1, ed. 1.0 (2011)
Hide details for passive elementspassive elements
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for passive hybrid film integrated circuitpassive hybrid film integrated circuit
IEC 60748-1, ed. 2.0 (2002)
Hide details for passive IC function modulepassive IC function module
IEC 61967-4-1, ed. 1.0 (2005)
Hide details for patterned substratepatterned substrate
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for peak detectorpeak detector
IEC 61967-1, ed. 1.0 (2002)
Hide details for peak powerpeak power
IEC 62132-1, ed. 2.0 (2015)
Hide details for [<span>performance degradation</span>]performance degradation
IEC 62215-3, ed. 1.0 (2013)
Hide details for pitpit
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for planar elementplanar element
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for plated filmplated film
IEC 60748-1, ed. 2.0 (2002)
Hide details for portport
IEC 61967-4-1, ed. 1.0 (2005)
Hide details for preamp noise floorpreamp noise floor
IEC 61967-1, ed. 1.0 (2002)
Hide details for primary (field) componentprimary (field) component
IEC 61967-8, ed. 1.0 (2011)
IEC 62132-2, ed. 1.0 (2010)
Hide details for primary field component; primary componentprimary field component; primary component
IEC 62132-8, ed. 1.0 (2012)
Hide details for primary stage of manufactureprimary stage of manufacture
IEC 60748-23-1, ed. 1.0 (2002)
Hide details for printed circuit board, PCBprinted circuit board, PCB
IEC 61967-4-1, ed. 1.0 (2005)
Hide details for probe factorprobe factor
IEC 61967-1-1, ed. 2.0 (2015)
IEC 61967-3, ed. 1.0 (2014)
IEC 62132-9, ed. 1.0 (2014)
Hide details for process test vehicle (PTV)process test vehicle (PTV)
IEC 60748-23-1, ed. 1.0 (2002)
Hide details for product assessment level schedules (PALS)product assessment level schedules (PALS)
IEC 60748-23-1, ed. 1.0 (2002)
Hide details for protective coatingprotective coating
IEC 60748-1, ed. 2.0 (2002)
Hide details for protrusionprotrusion
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for qualification circuit (QC)qualification circuit (QC)
IEC 60748-23-1, ed. 1.0 (2002)
Hide details for radio frequency ambient, RF ambientradio frequency ambient, RF ambient
IEC 62132-1, ed. 2.0 (2015)
Hide details for receiver terminal voltagereceiver terminal voltage
IEC 61967-1, ed. 1.0 (2002)
Hide details for reference nodereference node
IEC 62433-1, ed. 1.0 (2011)
Hide details for reference pointreference point
IEC 61967-1, ed. 1.0 (2002)
Hide details for reference portreference port
IEC 62132-1, ed. 2.0 (2015)
Hide details for reference terminalreference terminal
IEC 62433-1, ed. 1.0 (2011)
Hide details for reflected powerreflected power
IEC 62132-1, ed. 2.0 (2015)
Hide details for repairrepair
IEC 60748-23-1, ed. 1.0 (2002)
Hide details for repetition raterepetition rate
IEC 61967-1, ed. 1.0 (2002)
Hide details for resistor ladderresistor ladder
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for resistor ladder rungresistor ladder rung
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for resistor loopresistor loop
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for resistor material, self passivatingresistor material, self passivating
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for [<span>response signal</span>]response signal
IEC 62215-3, ed. 1.0 (2013)
Hide details for reworkrework
IEC 60748-23-1, ed. 1.0 (2002)
Hide details for RF power meterRF power meter
IEC 62132-1, ed. 2.0 (2015)
Hide details for scorchingscorching
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for scratch, metallizationscratch, metallization
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for scratch, resistorscratch, resistor
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for screen-printing techniquescreen-printing technique
IEC 60748-1, ed. 2.0 (2002)
Hide details for screeningscreening
IEC 60748-23-1, ed. 1.0 (2002)
Hide details for secondary (field) componentsecondary (field) component
IEC 62132-2, ed. 1.0 (2010)
Hide details for sectionsection
IEC 61967-1-1, ed. 2.0 (2015)
Hide details for semiconductor devicesemiconductor device
IEC 60748-1, ed. 2.0 (2002)
Hide details for semiconductor integrated circuitsemiconductor integrated circuit
IEC 60748-1, ed. 2.0 (2002)
Hide details for shielded enclosureshielded enclosure
IEC 61967-1, ed. 1.0 (2002)
IEC 62132-1, ed. 2.0 (2015)
Hide details for sidebarsidebar
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for signal-dependent timing errorsignal-dependent timing error
IEC 60748-4-3, ed. 1.0 (2006)
Hide details for signal-to-noise-and-distortion ratiosignal-to-noise-and-distortion ratio
IEC 60748-4-3, ed. 1.0 (2006)
Hide details for significant IC changessignificant IC changes
IEC 61967-1, ed. 1.0 (2002)
Hide details for single-chip integrated circuitsingle-chip integrated circuit
IEC 60748-1, ed. 2.0 (2002)
Hide details for spatial resolutionspatial resolution
IEC 61967-3, ed. 1.0 (2014)
IEC 62132-9, ed. 1.0 (2014)
Hide details for (spurious-free) dynamic range(spurious-free) dynamic range
IEC 60748-4-3, ed. 1.0 (2006)
Hide details for spurious frequencyspurious frequency
IEC 60748-4-3, ed. 1.0 (2006)
Hide details for sputteringsputtering
IEC 60748-1, ed. 2.0 (2002)
Hide details for stringstring
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for substrate (of a film integrated circuit)substrate (of a film integrated circuit)
IEC 60748-1, ed. 2.0 (2002)
Hide details for supply pin pairssupply pin pairs
IEC 61967-4-1, ed. 1.0 (2005)
Hide details for surface acoustic wave (SAW) elementsurface acoustic wave (SAW) element
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for [<span>surge voltage</span>]surge voltage
IEC 62215-3, ed. 1.0 (2013)
Hide details for system gainsystem gain
IEC 61967-1, ed. 1.0 (2002)
Hide details for TEM cellTEM cell
IEC 62132-2, ed. 1.0 (2010)
Hide details for TEM waveguideTEM waveguide
IEC 61967-8, ed. 1.0 (2011)
IEC 62132-2, ed. 1.0 (2010)
IEC 62132-8, ed. 1.0 (2012)
Hide details for terminal (of a semiconductor device)terminal (of a semiconductor device)
IEC 60748-1, ed. 2.0 (2002)
Hide details for test generatortest generator
IEC 62132-1, ed. 2.0 (2015)
Hide details for test plantest plan
IEC 61967-1, ed. 1.0 (2002)
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IEC 61967-4-1, ed. 1.0 (2005)
Hide details for thick-film integrated circuitthick-film integrated circuit
IEC 60748-1, ed. 2.0 (2002)
Hide details for thick filmthick film
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for thick film (of a film integrated circuit)thick film (of a film integrated circuit)
IEC 60748-1, ed. 2.0 (2002)
Hide details for thin-film integrated circuitthin-film integrated circuit
IEC 60748-1, ed. 2.0 (2002)
Hide details for thin filmthin film
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for thin film (of a film integrated circuit)thin film (of a film integrated circuit)
IEC 60748-1, ed. 2.0 (2002)
Hide details for through-hole metallizationthrough-hole metallization
IEC 60748-23-2, ed. 1.0 (2002)
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IEC 60748-23-2, ed. 1.0 (2002)
Hide details for [<span>transient</span>]transient
IEC 62215-3, ed. 1.0 (2013)
Hide details for transverse electromagnetic mode (TEM)transverse electromagnetic mode (TEM)
IEC 62132-2, ed. 1.0 (2010)
Hide details for transverse electromagnetic mode, TEMtransverse electromagnetic mode, TEM
IEC 62132-8, ed. 1.0 (2012)
Hide details for transverse electromagnetic (TEM) modetransverse electromagnetic (TEM) mode
IEC 61967-8, ed. 1.0 (2011)
Hide details for tuningtuning
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for two-port TEM waveguidetwo-port TEM waveguide
IEC 61967-8, ed. 1.0 (2011)
IEC 62132-2, ed. 1.0 (2010)
IEC 62132-8, ed. 1.0 (2012)
Hide details for underlying materialunderlying material
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for unused component or unused deposited elementunused component or unused deposited element
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for upper category temperature (UCT)upper category temperature (UCT)
IEC 60748-23-1, ed. 1.0 (2002)
Hide details for vapour-phase deposition techniquevapour-phase deposition technique
IEC 60748-1, ed. 2.0 (2002)
Hide details for viavia
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for visible linevisible line
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for vitrificationvitrification
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for voidvoid
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for void, metallizationvoid, metallization
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for void, resistorvoid, resistor
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for [<span>VS</span>]VS
IEC 62215-3, ed. 1.0 (2013)
Hide details for word error rateword error rate
IEC 60748-4-3, ed. 1.0 (2006)
Hide details for wrap-around conductorwrap-around conductor
IEC 60748-23-2, ed. 1.0 (2002)
Hide details for [<span>Z<sub>L</sub></span>]ZL
IEC 62215-3, ed. 1.0 (2013)


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