| | |
absolute maximum continuous ratings | |
| IEC 60748-2-20, ed. 2.0 (2008) | |
active circuit area | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
active hybrid film integrated circuit | |
| IEC 60748-1, ed. 2.0 (2002) | |
active IC function module | |
| IEC 61967-4-1, ed. 1.0 (2005) | |
active port | |
| IEC 61967-4-1, ed. 1.0 (2005) | |
add-on substrate | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
added component | |
| IEC 60748-23-1, ed. 1.0 (2002) | |
altitude | |
| IEC 61967-3, ed. 1.0 (2014) | |
| IEC 62132-9, ed. 1.0 (2014) | |
amplitude modulation; AM | |
| IEC 62132-1, ed. 2.0 (2015) | |
analog | |
| IEC 61967-4-1, ed. 1.0 (2005) | |
anechoic material | |
| IEC 62132-2, ed. 1.0 (2010) | |
artificial network, AN | |
| IEC 61967-1, ed. 1.0 (2002) | |
| IEC 62132-1, ed. 2.0 (2015) | |
associated equipment | |
| IEC 61967-1, ed. 1.0 (2002) | |
| IEC 62132-1, ed. 2.0 (2015) | |
attachment medium | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
auto sweep | |
| IEC 61967-1, ed. 1.0 (2002) | |
auxiliary equipment | |
| IEC 62215-3, ed. 1.0 (2013) | |
auxiliary equipment, AE | |
| IEC 62132-1, ed. 2.0 (2015) | |
bias tee | |
| IEC 62132-1, ed. 2.0 (2015) | |
blank terminal | |
| IEC 60748-1, ed. 2.0 (2002) | |
blister, metallization | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
block resistor | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
bonding pad | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
bonding site | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
bridging | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
broadband emission | |
| IEC 61967-1, ed. 1.0 (2002) | |
broadband line termination | |
| IEC 62132-2, ed. 1.0 (2010) | |
burn-in | |
| IEC 60748-23-1, ed. 1.0 (2002) | |
burst | |
| IEC 62215-3, ed. 1.0 (2013) | |
capability qualifying component (CQC) | |
| IEC 60748-23-1, ed. 1.0 (2002) | |
category dissipation | |
| IEC 60748-23-1, ed. 1.0 (2002) | |
certified manufacturing line | |
| IEC 60748-23-1, ed. 1.0 (2002) | |
characteristic impedance | |
| IEC 61967-8, ed. 1.0 (2011) | |
| IEC 62132-2, ed. 1.0 (2010) | |
| IEC 62132-8, ed. 1.0 (2012) | |
child | |
| IEC 61967-1-1, ed. 2.0 (2015) | |
(code) transition value | |
| IEC 60748-4-3, ed. 1.0 (2006) | |
coherent sampling | |
| IEC 60748-4-3, ed. 1.0 (2006) | |
cold solder joint | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
common-mode point | |
| IEC 62132-5, ed. 1.0 (2005) | |
common-mode port | |
| IEC 62132-5, ed. 1.0 (2005) | |
common mode (CM) current | |
| IEC 61967-4-1, ed. 1.0 (2005) | |
common mode current | |
| IEC 61967-1, ed. 1.0 (2002) | |
| IEC 62132-1, ed. 2.0 (2015) | |
common mode voltage | |
| IEC 62132-1, ed. 2.0 (2015) | |
common mode voltage; asymmetrical voltage | |
| IEC 61967-1, ed. 1.0 (2002) | |
compound bond | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
conducted emissions | |
| IEC 61967-1, ed. 1.0 (2002) | |
conductive attach | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
conductive substrate | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
contact window | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
continuous disturbance | |
| IEC 61967-1, ed. 1.0 (2002) | |
continuous wave, CW | |
| IEC 62132-1, ed. 2.0 (2015) | |
controlled environment | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
core | |
| IEC 61967-4-1, ed. 1.0 (2005) | |
corrosion | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
coupling (air) bridge | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
coupling network | |
| IEC 62132-1, ed. 2.0 (2015) | |
coupling network | |
| IEC 62215-3, ed. 1.0 (2013) | |
crazing | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
crossover | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
custom designed | |
| IEC 60748-23-1, ed. 1.0 (2002) | |
decoupling network | |
| IEC 62132-1, ed. 2.0 (2015) | |
detritus | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
device under test, DUT | |
| IEC 61967-1, ed. 1.0 (2002) | |
| IEC 62132-1, ed. 2.0 (2015) | |
die shrink | |
| IEC 61967-1, ed. 1.0 (2002) | |
| IEC 62132-1, ed. 2.0 (2015) | |
dielectric | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
dielectric attach | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
differential mode current | |
| IEC 61967-1, ed. 1.0 (2002) | |
| IEC 62132-1, ed. 2.0 (2015) | |
differential mode (DM) current | |
| IEC 61967-4-1, ed. 1.0 (2005) | |
differential mode voltage | |
| IEC 61967-1, ed. 1.0 (2002) | |
| IEC 62132-1, ed. 2.0 (2015) | |
digital | |
| IEC 61967-4-1, ed. 1.0 (2005) | |
directional coupler | |
| IEC 62132-1, ed. 2.0 (2015) | |
discontinuous disturbance | |
| IEC 61967-1, ed. 1.0 (2002) | |
DUT | |
| IEC 62215-3, ed. 1.0 (2013) | |
edge metallization | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
effective number of bits, Nef | |
| IEC 60748-4-3, ed. 1.0 (2006) | |
electrical endurance | |
| IEC 60748-23-1, ed. 1.0 (2002) | |
electrically common | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
electrically small PCB | |
| IEC 61967-1, ed. 1.0 (2002) | |
electrically small PCB | |
| IEC 62132-1, ed. 2.0 (2015) | |
electrode (of a semiconductor device) | |
| IEC 60748-1, ed. 2.0 (2002) | |
electromagnetic ambient | |
| IEC 62215-3, ed. 1.0 (2013) | |
electromagnetic compatibility, EMC | |
| IEC 61967-1, ed. 1.0 (2002) | |
| IEC 62132-1, ed. 2.0 (2015) | |
electromagnetic emission | |
| IEC 61967-1, ed. 1.0 (2002) | |
electromagnetic environment (RF ambient) | |
| IEC 61967-1, ed. 1.0 (2002) | |
electromagnetic radiation; radiated emissions | |
| IEC 61967-1, ed. 1.0 (2002) | |
element | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
embedding | |
| IEC 60748-1, ed. 2.0 (2002) | |
EMC | |
| IEC 62215-3, ed. 1.0 (2013) | |
emission limit (from a disturbing source) | |
| IEC 61967-1, ed. 1.0 (2002) | |
end terminated or wrap-around elements | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
equivalent-time sampling | |
| IEC 60748-4-3, ed. 1.0 (2006) | |
external terminal | |
| IEC 62433-2, ed. 1.0 (2008) | |
film circuit element | |
| IEC 60748-23-1, ed. 1.0 (2002) | |
film integrated circuit | |
| IEC 60748-1, ed. 2.0 (2002) | |
film (of a film integrated circuit) | |
| IEC 60748-1, ed. 2.0 (2002) | |
fixed function unit, FFU | |
| IEC 61967-4-1, ed. 1.0 (2005) | |
foil | |
| IEC 60748-1, ed. 2.0 (2002) | |
foreign material | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
forward power | |
| IEC 62132-1, ed. 2.0 (2015) | |
garbage collection | |
| IEC 60748-1, ed. 2.0 (2002) | |
garbage data | |
| IEC 60748-1, ed. 2.0 (2002) | |
glassivation | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
global pin | |
| IEC 61967-4-1, ed. 1.0 (2005) | |
global pin | |
| IEC 62215-3, ed. 1.0 (2013) | |
ground plane, reference ground plane | |
| IEC 62132-1, ed. 2.0 (2015) | |
ground (reference) plane | |
| IEC 61967-1, ed. 1.0 (2002) | |
hybrid film integrated circuit | |
| IEC 60748-1, ed. 2.0 (2002) | |
hybrid integrated circuit | |
| IEC 60748-1, ed. 2.0 (2002) | |
hybrid semiconductor integrated circuit | |
| IEC 60748-1, ed. 2.0 (2002) | |
IC function module | |
| IEC 61967-4-1, ed. 1.0 (2005) | |
IC stripline | |
| IEC 61967-8, ed. 1.0 (2011) | |
| IEC 62132-8, ed. 1.0 (2012) | |
IC type | |
| IEC 61967-4-1, ed. 1.0 (2005) | |
immunity | |
| IEC 62132-1, ed. 2.0 (2015) | |
immunity | |
| IEC 62215-3, ed. 1.0 (2013) | |
inactive port | |
| IEC 61967-4-1, ed. 1.0 (2005) | |
injection network | |
| IEC 62132-1, ed. 2.0 (2015) | |
input clamping current IIK | |
| IEC 60748-1, ed. 2.0 (2002) | |
input clamping voltage VIK | |
| IEC 60748-1, ed. 2.0 (2002) | |
insulating layer | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
integrated circuit | |
| IEC 60748-1, ed. 2.0 (2002) | |
integrated circuit, IC | |
| IEC 61967-4-1, ed. 1.0 (2005) | |
integrated electronics | |
| IEC 60748-1, ed. 2.0 (2002) | |
inter-block coupling, IBC | |
| IEC 62433-1, ed. 1.0 (2011) | |
intermetallics (purple plague) | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
internal activity, IA | |
| IEC 62433-1, ed. 1.0 (2011) | |
internal terminal | |
| IEC 62433-2, ed. 1.0 (2008) | |
jitter | |
| IEC 62215-3, ed. 1.0 (2013) | |
kerf | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
latch-up | |
| IEC 60748-1, ed. 2.0 (2002) | |
latch-up characteristics of integrated circuits | |
| IEC 60748-1, ed. 2.0 (2002) | |
latch-up current (IXlatch, Ilatch) | |
| IEC 60748-1, ed. 2.0 (2002) | |
latch-up state | |
| IEC 60748-1, ed. 2.0 (2002) | |
latch-up state holding current (ICC(L)min, IDD(L)min) | |
| IEC 60748-1, ed. 2.0 (2002) | |
latch-up state (supply) current (ICC(L), IDD(L)) | |
| IEC 60748-1, ed. 2.0 (2002) | |
latch-up state (supply) voltage (VCC(L), VDD(L)) | |
| IEC 60748-1, ed. 2.0 (2002) | |
latch-up supply current (ICClatch, IDDlatch) | |
| IEC 60748-1, ed. 2.0 (2002) | |
latch-up supply voltage (VCClatch, VDDlatch) | |
| IEC 60748-1, ed. 2.0 (2002) | |
latch-up voltage (VXlatch, Vlatch) | |
| IEC 60748-1, ed. 2.0 (2002) | |
lead frame | |
| IEC 61967-1, ed. 1.0 (2002) | |
local pin | |
| IEC 61967-4-1, ed. 1.0 (2005) | |
local pin | |
| IEC 62215-3, ed. 1.0 (2013) | |
lower category temperature (LCT) | |
| IEC 60748-23-1, ed. 1.0 (2002) | |
mar | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
measurement uncertainty | |
| IEC 60748-23-1, ed. 1.0 (2002) | |
measuring receiver | |
| IEC 61967-1, ed. 1.0 (2002) | |
mechanical strength tests | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
metallization, multilayered (conductors) | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
metallization, multilevel (conductors) | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
metallization, operating (conductors) | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
microcircuit | |
| IEC 60748-1, ed. 2.0 (2002) | |
microelectronics | |
| IEC 60748-1, ed. 2.0 (2002) | |
multi-chip integrated circuit | |
| IEC 60748-1, ed. 2.0 (2002) | |
multi-chip module, MCM | |
| IEC 61967-1, ed. 1.0 (2002) | |
multi IC sets | |
| IEC 61967-1, ed. 1.0 (2002) | |
multilayer (connection) film circuit | |
| IEC 60748-1, ed. 2.0 (2002) | |
narrowband emission | |
| IEC 61967-1, ed. 1.0 (2002) | |
narrowest resistor width | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
neck-down | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
nicking (partial cut) | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
nodule, metallization | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
non-monometallic compound bond | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
non-planar element | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
non-usable terminal | |
| IEC 60748-1, ed. 2.0 (2002) | |
one-port TEM waveguide | |
| IEC 62132-2, ed. 1.0 (2010) | |
operating conditions | |
| IEC 60748-2-20, ed. 2.0 (2008) | |
operating metallization (conductors) | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
original design separation | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
original width | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
output characteristics | |
| IEC 60748-2-20, ed. 2.0 (2008) | |
output clamping current IOK | |
| IEC 60748-1, ed. 2.0 (2002) | |
output clamping voltage VOK | |
| IEC 60748-1, ed. 2.0 (2002) | |
oxide non-conformance | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
package | |
| IEC 60748-23-1, ed. 1.0 (2002) | |
parent | |
| IEC 61967-1-1, ed. 2.0 (2015) | |
part-finished | |
| IEC 60748-23-1, ed. 1.0 (2002) | |
passivation | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
passivation step | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
passive distribution network, PDN | |
| IEC 62433-1, ed. 1.0 (2011) | |
passive elements | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
passive hybrid film integrated circuit | |
| IEC 60748-1, ed. 2.0 (2002) | |
passive IC function module | |
| IEC 61967-4-1, ed. 1.0 (2005) | |
patterned substrate | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
peak detector | |
| IEC 61967-1, ed. 1.0 (2002) | |
peak power | |
| IEC 62132-1, ed. 2.0 (2015) | |
performance degradation | |
| IEC 62215-3, ed. 1.0 (2013) | |
pit | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
planar element | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
plated film | |
| IEC 60748-1, ed. 2.0 (2002) | |
port | |
| IEC 61967-4-1, ed. 1.0 (2005) | |
preamp noise floor | |
| IEC 61967-1, ed. 1.0 (2002) | |
primary (field) component | |
| IEC 61967-8, ed. 1.0 (2011) | |
| IEC 62132-2, ed. 1.0 (2010) | |
primary field component; primary component | |
| IEC 62132-8, ed. 1.0 (2012) | |
primary stage of manufacture | |
| IEC 60748-23-1, ed. 1.0 (2002) | |
printed circuit board, PCB | |
| IEC 61967-4-1, ed. 1.0 (2005) | |
probe factor | |
| IEC 61967-1-1, ed. 2.0 (2015) | |
| IEC 61967-3, ed. 1.0 (2014) | |
| IEC 62132-9, ed. 1.0 (2014) | |
process test vehicle (PTV) | |
| IEC 60748-23-1, ed. 1.0 (2002) | |
product assessment level schedules (PALS) | |
| IEC 60748-23-1, ed. 1.0 (2002) | |
protective coating | |
| IEC 60748-1, ed. 2.0 (2002) | |
protrusion | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
qualification circuit (QC) | |
| IEC 60748-23-1, ed. 1.0 (2002) | |
radio frequency ambient, RF ambient | |
| IEC 62132-1, ed. 2.0 (2015) | |
receiver terminal voltage | |
| IEC 61967-1, ed. 1.0 (2002) | |
reference node | |
| IEC 62433-1, ed. 1.0 (2011) | |
reference point | |
| IEC 61967-1, ed. 1.0 (2002) | |
reference port | |
| IEC 62132-1, ed. 2.0 (2015) | |
reference terminal | |
| IEC 62433-1, ed. 1.0 (2011) | |
reflected power | |
| IEC 62132-1, ed. 2.0 (2015) | |
repair | |
| IEC 60748-23-1, ed. 1.0 (2002) | |
repetition rate | |
| IEC 61967-1, ed. 1.0 (2002) | |
resistor ladder | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
resistor ladder rung | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
resistor loop | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
resistor material, self passivating | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
response signal | |
| IEC 62215-3, ed. 1.0 (2013) | |
rework | |
| IEC 60748-23-1, ed. 1.0 (2002) | |
RF power meter | |
| IEC 62132-1, ed. 2.0 (2015) | |
scorching | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
scratch, metallization | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
scratch, resistor | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
screen-printing technique | |
| IEC 60748-1, ed. 2.0 (2002) | |
screening | |
| IEC 60748-23-1, ed. 1.0 (2002) | |
secondary (field) component | |
| IEC 62132-2, ed. 1.0 (2010) | |
section | |
| IEC 61967-1-1, ed. 2.0 (2015) | |
semiconductor device | |
| IEC 60748-1, ed. 2.0 (2002) | |
semiconductor integrated circuit | |
| IEC 60748-1, ed. 2.0 (2002) | |
shielded enclosure | |
| IEC 61967-1, ed. 1.0 (2002) | |
| IEC 62132-1, ed. 2.0 (2015) | |
sidebar | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
signal-dependent timing error | |
| IEC 60748-4-3, ed. 1.0 (2006) | |
signal-to-noise-and-distortion ratio | |
| IEC 60748-4-3, ed. 1.0 (2006) | |
significant IC changes | |
| IEC 61967-1, ed. 1.0 (2002) | |
single-chip integrated circuit | |
| IEC 60748-1, ed. 2.0 (2002) | |
spatial resolution | |
| IEC 61967-3, ed. 1.0 (2014) | |
| IEC 62132-9, ed. 1.0 (2014) | |
(spurious-free) dynamic range | |
| IEC 60748-4-3, ed. 1.0 (2006) | |
spurious frequency | |
| IEC 60748-4-3, ed. 1.0 (2006) | |
sputtering | |
| IEC 60748-1, ed. 2.0 (2002) | |
string | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
substrate (of a film integrated circuit) | |
| IEC 60748-1, ed. 2.0 (2002) | |
supply pin pairs | |
| IEC 61967-4-1, ed. 1.0 (2005) | |
surface acoustic wave (SAW) element | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
surge voltage | |
| IEC 62215-3, ed. 1.0 (2013) | |
system gain | |
| IEC 61967-1, ed. 1.0 (2002) | |
TEM cell | |
| IEC 62132-2, ed. 1.0 (2010) | |
TEM waveguide | |
| IEC 61967-8, ed. 1.0 (2011) | |
| IEC 62132-2, ed. 1.0 (2010) | |
| IEC 62132-8, ed. 1.0 (2012) | |
terminal (of a semiconductor device) | |
| IEC 60748-1, ed. 2.0 (2002) | |
test generator | |
| IEC 62132-1, ed. 2.0 (2015) | |
test plan | |
| IEC 61967-1, ed. 1.0 (2002) | |
test port | |
| IEC 61967-4-1, ed. 1.0 (2005) | |
thick-film integrated circuit | |
| IEC 60748-1, ed. 2.0 (2002) | |
thick film | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
thick film (of a film integrated circuit) | |
| IEC 60748-1, ed. 2.0 (2002) | |
thin-film integrated circuit | |
| IEC 60748-1, ed. 2.0 (2002) | |
thin film | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
thin film (of a film integrated circuit) | |
| IEC 60748-1, ed. 2.0 (2002) | |
through-hole metallization | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
tine | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
transient | |
| IEC 62215-3, ed. 1.0 (2013) | |
transverse electromagnetic mode (TEM) | |
| IEC 62132-2, ed. 1.0 (2010) | |
transverse electromagnetic mode, TEM | |
| IEC 62132-8, ed. 1.0 (2012) | |
transverse electromagnetic (TEM) mode | |
| IEC 61967-8, ed. 1.0 (2011) | |
tuning | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
two-port TEM waveguide | |
| IEC 61967-8, ed. 1.0 (2011) | |
| IEC 62132-2, ed. 1.0 (2010) | |
| IEC 62132-8, ed. 1.0 (2012) | |
underlying material | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
unused component or unused deposited element | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
upper category temperature (UCT) | |
| IEC 60748-23-1, ed. 1.0 (2002) | |
vapour-phase deposition technique | |
| IEC 60748-1, ed. 2.0 (2002) | |
via | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
visible line | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
vitrification | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
void | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
void, metallization | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
void, resistor | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
VS | |
| IEC 62215-3, ed. 1.0 (2013) | |
word error rate | |
| IEC 60748-4-3, ed. 1.0 (2006) | |
wrap-around conductor | |
| IEC 60748-23-2, ed. 1.0 (2002) | |
ZL | |
| IEC 62215-3, ed. 1.0 (2013) | |