| | | |
|
3.1 | | | active circuit area | |
|
3.2 | | | add-on substrate | |
|
3.3 | | | attachment medium | |
|
3.4 | | | blister, metallization | |
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3.5 | | | block resistor | |
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3.6 | | | bonding pad | |
|
3.7 | | | bonding site | |
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3.8 | | | bridging | |
|
3.9 | | | cold solder joint | |
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3.10 | | | compound bond | |
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3.11 | | | conductive attach | |
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3.12 | | | conductive substrate | |
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3.13 | | | contact window | |
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3.14 | | | controlled environment | |
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3.15 | | | corrosion | |
|
3.16 | | | coupling (air) bridge | |
|
3.17 | | | crazing | |
|
3.18 | | | crossover | |
|
3.19 | | | detritus | |
|
3.20 | | | dielectric | |
|
3.21 | | | dielectric attach | |
|
3.22 | | | edge metallization | |
|
3.23 | | | element | |
|
3.24 | | | electrically common | |
|
3.25 | | | end terminated or wrap-around elements | |
|
3.26 | | | foreign material | |
|
3.27 | | | glassivation | |
|
3.28 | | | insulating layer | |
|
3.29 | | | intermetallics (purple plague) | |
|
3.30 | | | kerf | |
|
3.31 | | | mar | |
|
3.32 | | | mechanical strength tests | |
|
3.33 | | | metallization, multilevel (conductors) | |
|
3.34 | | | metallization, multilayered (conductors) | |
|
3.35 | | | metallization, operating (conductors) | |
|
3.36 | | | narrowest resistor width | |
|
3.37 | | | neck-down | |
|
3.38 | | | nicking (partial cut) | |
|
3.39 | | | nodule, metallization | |
|
3.40 | | | non-monometallic compound bond | |
|
3.41 | | | non-planar element | |
|
3.42 | | | operating metallization (conductors) | |
|
3.43 | | | original design separation | |
|
3.44 | | | original width | |
|
3.45 | | | oxide non-conformance | |
|
3.46 | | | passivation | |
|
3.47 | | | passivation step | |
|
3.48 | | | passive elements | |
|
3.49 | | | patterned substrate | |
|
3.50 | | | pit | |
|
3.51 | | | planar element | |
|
3.52 | | | protrusion | |
|
3.53 | | | resistor ladder | |
|
3.54 | | | resistor ladder rung | |
|
3.55 | | | resistor loop | |
|
3.56 | | | resistor material, self passivating | |
|
3.57 | | | scorching | |
|
3.58 | | | scratch, metallization | |
|
3.59 | | | scratch, resistor | |
|
3.60 | | | sidebar | |
|
3.61 | | | string | |
|
3.62 | | | surface acoustic wave (SAW) element | |
|
3.63 | | | thick film | |
|
3.64 | | | thin film | |
|
3.65 | | | tine | |
|
3.66 | | | tuning | |
|
3.67 | | | through-hole metallization | |
|
3.68 | | | underlying material | |
|
3.69 | | | unused component or unused deposited element | |
|
3.70 | | | via | |
|
3.71 | | | visible line | |
|
3.72 | | | vitrification | |
|
3.73 | | | void | |
|
3.74 | | | void, metallization | |
|
3.75 | | | void, resistor | |
|
3.76 | | | wrap-around conductor | |