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Area: 523: Micro-electromechanical devices           Index language:

Hide details for [<u>Section 523-01: General</u>]Section 523-01: General
523-01-01
micro-electromechanical device
523-01-02
MST
523-01-03
micromachine
Hide details for [<u>Section 523-02: Science and engineering</u>]Section 523-02: Science and engineering
523-02-01
scale effect
523-02-02
microtribology
523-02-03
electro-wetting on dielectric
523-02-04
stiction
523-02-05
hydrophilic, adj
523-02-06
hydrophobic, adj
Hide details for [<u>Section 523-03: Material science</u>]Section 523-03: Material science
523-03-01
maximum force, <in a cycle>
523-03-02
minimum force, <in a cycle>
523-03-03
mean force
523-03-04
maximum displacement
523-03-05
minimum displacement
523-03-06
mean displacement
523-03-07
displacement range
523-03-08
force ratio
523-03-10
deflection angle
523-03-11
amplitude, <micro-electromechanical devices>
523-03-12
S-N curve
523-03-13
failure strength
523-03-14
instantaneous failure strength
523-03-15
grid pattern
523-03-16
residual stress
523-03-17
curvature
523-03-18
membrane window
523-03-19
gauge factor
523-03-20
elongation at electrical failure
Hide details for [<u>Section 523-03: </u>]Section 523-03:
523-03-09
deflection, <of a test piece>
Hide details for [<u>Section 523-04: Functional elements</u>]Section 523-04: Functional elements
523-04-01
biosensor
523-04-02
integrated microprobe
523-04-03
ISFET
523-04-04
microgyroscope
523-04-05
diaphragm structure
523-04-06
microcantilever
523-04-07
microchannel
523-04-08
microactuator
523-04-09
light-driven actuator
523-04-10
piezoelectric actuator
523-04-11
shape-memory alloy actuator
523-04-12
comb-drive actuator
523-04-13
scanning mirror
523-04-15
microgripper
523-04-16
micropump
523-04-17
microvalve
523-04-18
micro fuel cell
523-04-19
photoelectric transducer
523-04-20
silicon-on-insulator
523-04-21
e-compass
523-04-22
2-axis e-compass
523-04-23
3-axis e-compass
523-04-24
6-axis e-compass
523-04-25
CMOS MEMS
Hide details for [<u>Section 523-04: </u>]Section 523-04:
523-04-14
optical switch
Hide details for [<u>Section 523-05: Machining technology</u>]Section 523-05: Machining technology
523-05-01
thick film technology
523-05-02
thin film technology
523-05-03
bulk micromachining
523-05-04
surface micromachining
523-05-06
LIGA process
523-05-07
laser dicing
523-05-09
anisotropic etching
523-05-12
reactive ion etching
523-05-13
deep reactive ion etching
523-05-14
inductively coupled plasma
523-05-15
atomic layer deposition
523-05-16
self-assembled monolayer
523-05-17
electroforming
523-05-18
nanoimprint
523-05-19
micromoulding
523-05-20
STM machining
Hide details for [<u>Section 523-05: </u>]Section 523-05:
523-05-05
surface modification
523-05-08
isotropic etching
523-05-10
etch stop
523-05-11
sacrificial etching
Hide details for [<u>Section 523-06: Bonding and assembling technology</u>]Section 523-06: Bonding and assembling technology
523-06-01
bonding
523-06-02
anodic bonding
523-06-03
diffusion bonding
523-06-04
surface-activated bonding
523-06-05
silicon fusion bonding
523-06-06
packaging, <of components>
523-06-07
wafer level packaging
523-06-08
through-silicon-via
523-06-10
adhesive shear strength
Hide details for [<u>Section 523-06: </u>]Section 523-06:
523-06-09
adhesive bend strength
Hide details for [<u>Section 523-07: Measurement technology</u>]Section 523-07: Measurement technology
523-07-01
scanning probe microscope
523-07-02
atomic force microscope
523-07-03
spectroscopic ellipsometry
523-07-04
aspect ratio, <micro-electromechanical devices>
Hide details for [<u>Section 523-08: Application technologies</u>]Section 523-08: Application technologies
523-08-01
bio-MEMS
523-08-02
MOEMS
523-08-03
power MEMS
523-08-04
energy harvesting
523-08-05
lab-on-a-chip
523-08-06
micro TAS
523-08-07
microreactor
523-08-08
fibre endoscope
523-08-09
bio-chip
523-08-10
DNA chip
523-08-11
protein chip
523-08-12
polymerase chain reaction


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