International
Electrotechnical
Commission
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Area
Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection
/ Materials for Surface Acoustic Wave (SAW) devices
IEV ref
561-07-09
en
diameter of wafer
diameter of the circular portion of a wafer excluding the
orientation flat
and the
secondary flat
fr
diamètre de la plaquette
, m
diamètre de la partie circulaire d’une plaquette, à l’exclusion du
plat d’orientation
et du
plat secondaire
ar
قطرالرقاقة
de
Waferdurchmesser, m
es
diámetro de agua
it
diametro della fetta
ko
웨이퍼 직경
ja
ウェハの直径
pl
średnica płytki, f
pt
diâmetro da bolacha
zh
晶片直径
Publication date:
2021-08
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