| process for bonding two substrates directly by increasing the surface energy of each substrate using ion beam or plasma irradiation
Note 1 to entry: Surface-activated bonding is effective in reducing thermal stress because the temperature in the bonding process is comparably low. In MEMS devices, surface-activated bonding is expected to be applied to the substrate bonding such as hermetic sealing.
Note 2 to entry: This note applies to the French language only.
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